Electronics & Semiconductor High-Precision Heat Treatment

The electronics manufacturing and semiconductor industry drives global digitalization, encompassing chip fabrication, electronic components, PCB assembly, and packaging/testing. Critical thermal processes—such as baking, curing, reflow soldering, and annealing—directly impact product yield and performance in semiconductor and microelectronics production.

To meet the industry’s stringent demands for cleanliness and temperature control precision, GUANDN provides the following solutions:

1.Precision Cleanroom Ovens (RT-300°C) Applications:Semiconductor wafer processing, photoresist curing.Key Features:Class 100 cleanroom compliance
±0.5°C temperature uniformity
Anti-static chamber design.

2.Tunnel Reflow Ovens (RT-400°C) ApplicationsSMT component soldering processes.Key Features:Multi-zone temperature control
10-zone precision temperature control
Optional nitrogen atmosphere protection
Thermal compensation for minimal heat loss.

3.Vacuum Annealing Furnaces (RT-500°C) Applications:High-end chip annealing.Key Features:Vacuum levels up to 10^⁻³ Pa
Rapid heating/cooling rates
Full process data logging.

Contamination-Free Design:Ideal for sensitive processes in semiconductor fabrication.

Process Repeatability:Ensures consistency for high-volume production.